1. Employs a professional temperature ramp-up algorithm and factory-calibrated temperature control curves to effectively prevent chip damage due to thermal stress.
2. Supports continuously adjustable temperatures from 160°C to 250°C, ensuring stable temperature control and meeting the adhesive and solder removal needs of various chips.
3. Concealed telescopic screw design, durable, easy to clean, and flexible in extension and clamping.
4. Fully concealed screw structure prevents debris from entering, ensuring no jamming or dirt accumulation and extending service life.
5. The 18×21mm miniature working area precisely concentrates heat on the chip body, minimizing temperature fluctuations and ensuring that the adhesive removal process does not burn the circuit board or damage the solder pads.
6. Supports 99% of adhesive and solder removal tasks for chips, hard drives, and CPUs on the market.