1. Specially designed for ultra-thin and flat cutting, allowing precise removal of underfill glue and solder pads without damaging nearby components.
2. Engineered to quickly cut through tough underfill glue around IC chips, significantly improving repair efficiency during motherboard rework.
3. Made of high-hardness stainless steel for excellent wear resistance, ensuring a long lifespan even under continuous use.
4. Ideal for technicians working on BGA, CPU, NAND, or other micro soldering tasks, especially suitable for high-density PCB boards.
5. Ultra-thin blade tip reaches narrow gaps under chips and small components, making it a must-have tool for precision electronic repairs.
6. Fully compatible with 2UUL blade handle systems, ensuring secure installation and comfortable grip during delicate operations.