1. Intelligent temperature control
2. Protect Motherboard, Desoldering PCBA Easily
3. Dual button design, adopting intergrated design of PCBA soldering and desoldering
4. Support: for iPhone X/XS/XS Max/11/11 Pro/11 Pro Max/12/12 Mini/12 Pro/12 Pro Max
5. Adopting AC high-frequency heating, PID temperature algorithm, temperature rising faster and more accurate.
6. Adopt Magnetic Flip design, start dormancy mode by automatic induction, better protection for users.
7. Adopting Layer-Fit Integrated Design Scheme, to stretch the deformed PCBA easily for heating fit by buckle lock.