1. Used to locate and relocate mobile phone PCB BGA parts
2. Convenient and quick re-bombardment of BGA without causing any damage, suitable for iPhone 11/11 Pro / 11 Pro Max BGA repositioning and repair to provide solutions
3. Unique hole design makes it easier to take out the formed solder balls
4. Fast and convenient soldering
5. Size: about 13x9x1.7cm
Findx F11-mini For iPhone 11 / 11 Pro / 11 Pro Max Reballing Stencil Platform Jig Fixture
₦44,100
Description
Additional information
| Weight | 0.319 kg |
|---|---|
| Dimensions | 14 × 10 × 3 cm |
Shipping Charge
