1. High temperature resistance, fast and convenient
2. This stencil is easy to use no matter you are a new or expert.
3. Precise position
4. This product is small and strong
5. High success rate of planting tin,the solder balls can be formed once after you are proficient
For Snapdragon 7Gen1/SM7450 Repairman High Precision Stencils CPU BGA iC Reballing Planting Tin Plate
₦7,400
SKU:
EDA004465405
Category: BGA Stencils
Description
Additional information
Weight | 0.054 kg |
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Shipping Charge
Lagos State
2000 NGN
Other Locations in Nigeria
7500 NGN
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