1. Supports CPU and chip soldering, suitable for chips with hard drives, with a maximum soldering thickness of 0.9mm.
2. High flexibility, not easily deformed, good elasticity, and can be freely rolled up.
3. Heat-resistant and anti-slip, can withstand temperatures up to 500 degrees Celsius, with adhesive properties for effective anti-slip.
4. High-strength magnetic steel mesh with strong magnetic adsorption design ensures a stronger and more stable soldering.
5. Compatible with chips less than 0.9mm thick, for soldering most current smartphone chips.