1. High-Precision BGA Reballing Stencil: The Mijing IPH-21 is specifically designed for iPhone XS to iPhone 16 Pro Max, ensuring precise alignment and perfect soldering for each solder point.
2. Multi-Functional Applicability: Suitable for various chips including baseband, hard disk, WiFi, and NFC, significantly enhancing repair efficiency.
3. Made from high heat-resistant and non-deformable materials, ensuring long-term stability and reliability during use.
4. Easy Operation Design: The stencil design is user-friendly, suitable for all types of technicians, allowing operation without professional training.
5. Enhanced Soldering Quality: With precise hole design, it effectively improves soldering quality, preventing shorts and cold joints.
6. High Temperature Resistance: Capable of withstanding high temperatures during the soldering process without deforming.