1. Middle frame reballing platform, precise positioning for the motherboard in high precision, strong magnetic pressing with no bulge
2. To show the beauty of design in a compact shape, motherboard reballing without worry is compact and easy, saving space
3. Magnet sliding dislocation design, smart application of the sliding dislocation design, easy to take
4. CNC high-precision integrated processing, stable positioning for the motherboard, no deviation in reballing
5. Strong magnetic attraction, accurate positioning no offset, and encountering high-temperature magnetism will not weaken
6. High-temperature magnetic strong pressing prevents the stencils from bulging caused by high-temperature
Qianli Magnetic Middle Layer BGA Reballing Platform For iPhone 14 Series
₦58,100
SKU:
EDA006242102
Category: BGA Stencils
Description
Additional information
| Weight | 0.204 kg |
|---|
Shipping Charge
Lagos State
2,000 NGN
Other Locations in Nigeria
8,500 NGN














