1. Designed for L2023 intelligent desoldering platform
2. Enlarged heating area, supports motherboard repair
3. Built-in strong magnetic design for easy module replacement
4. Securely fasten the motherboard to ensure proper fit during heating
5. Modular design allows for the replacement of corresponding positioning molds, enhancing practicality for maintenance
XZZ L2023 Heating Area Module, Module for iP17, Module for iP16, Module for iP15
₦21,100
Description
Additional information
| Weight | N/A |
|---|---|
| Dimensions | N/A |
| Option | Module for iP17, Module for iP16, Module for iP15 |
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